Category: Profilometry Testing
Surface Finish Inspection of Wood Flooring
Wood Wear Test with the Nanovea Tribometer
Portability and Flexibility of the Jr25 3D Non-contact Profilometer
Quality Analysis on Electrical Discharge Machined Metals
Electrical discharge machining, or EDM, is a manufacturing process that removes material via electrical
discharges [1]. This machining process is generally used with conductive metals that would be difficult
to machine with conventional methods.
As with all machining processes, precision and accuracy must be high in order to meet acceptable
tolerance levels. In this application note, the quality of the machined metals will be assessed with a
Nanovea 3D non-contact profilometer.
A Better Look at Paper
A BETTER Look at Polycarbonate Lens
500nm Glass Step Height: Extreme Accuracy with Non-Contact Profilometry
Surface characterization are current topics undergoing intense study. The surfaces of materials are important since they are the regions where physical and chemical interactions between the material and environment occur. Thus, being able to image the surface with high resolution has been desirable, since it allows scientists to visually observe the smallest surface details. Common surface imaging data includes topography, roughness, lateral dimensions, and vertical dimensions. Identifying the load bearing surface, spacing and step height of fabricated microstructures, and defects on the surface are some applications that can be obtained from surface imaging. All surface imaging techniques, however, are not created equal.
500nm Glass Step Height: Extreme Accuracy with Non-Contact Profilometry
Automated Large Area Profilometry of PCB
Scaling up of manufacturing processes is necessary for industries to grow and keep up with constantly increasing demands. As manufacturing process scales up, the tools used in quality control also need to be scaled up. These tools must be fast to keep up with the production rate, while still maintaining high accuracy to meet product tolerance limits. Here, the Nanovea HS2000 Profilometer, with Line Sensor, showcases its value as a quality control instrument with its fast, automated, and high-resolution large area profilometry capabilities.
Video Clip or App Note: Automated Large Area Profilometry of PCB
Mechanical Properties of Silicon Carbide Wafer Coatings
Understanding the mechanical properties of silicon carbide wafer coatings is critical. The fabrication process for microelectronic devices can have over 300 different processing steps and can take anywhere from six to eight weeks. During this process, the wafer substrate must be able to withstand the extreme conditions of manufacturing, since a failure at any step would result in the loss of time and money. The testing of hardness, adhesion/scratch resistance and COF/wear rate of the wafer must meet certain requirements in order to survive the conditions imposed during the manufacturing and application process to insure a failure will not occur.
Wafer Coating Thickness Measurement Using 3D Profilometry
Wafer Coating Thickness Measurement is critical. Silicon wafers are widely used in the making of integrated circuits and other micro devices used in a vast number of industries. A constant demand for thinner and smoother wafers and wafer coatings makes the Nanovea 3D non-contact Profilometer a great tool to quantify coating thickness and roughness of just about any surface. The measurements in this article were taken from a coated wafer sample in order to demonstrate the capabilities of our 3D Non-Contact Profilometer.




























