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Cutting Tool Edge Measurement in Seconds

Irvine CA, July 27, 2016 – Conventional profilometry scans sample surfaces from a single, fixed direction.  This is only appropriate for measuring sufficiently flat samples, as opposed to cylindrical shapes that require a precise 360° rotation. For an application such as characterizing the helical cutting edge of a tool, a conventional machine would need multiple scans from different angles of the entire part, as well as significant post scan data manipulation. This is often too time consuming for QC applications that only require measurements from very specific regions.

NANOVEA’S rotational stage solves this problem with simultaneous motion control of the lateral and rotational axes. This technique eliminates the time consuming need of measuring the entire part and continuous realignment. Instead, the full circumference of the entire cutting edge can be determined in seconds. All desired angles and features can be directly determined from the scan, with no need for the extensive stitching together of multiple files.

NANOVEA’s chromatic confocal technique offers far greater resolution, down to 2.7 nm, and accuracy than Focus Variation competitors. The raw surface height is measured directly from the detection of the wavelength focused on the surface, with none of the errors caused by Interferometry techniques, no field of view limitations, and no need for sample surface preparation. Materials with extremely high or low reflectivity can easily be measured and very high wall angles are accurately characterized without any issue.

Coupled with NANOVEA’s line sensor, a bar of data up to 4.78mm wide can be captured in a single pass, while moving linearly for up to 150mm in the scanning direction. Simultaneously, the rotational stage can revolve the sample at the desired speed. Put together, this system allows for the creation of a continuous 3D height map of the entire circumference of a cutting edge, with any pitch or radius, in a fraction of the time when compared to other technologies.

See App Note: Rotational Measurement Using 3D Profilometry

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