Thermomechanical Analysis of Solder Using Nanoindentation

Solder joints are subjected to thermal and/or external stress when the temperature exceeds 0.6 T_m where T_m is the melting point of the material in Kelvin. The creep behavior of solders at elevated temperatures can directly influence the reliability of solder interconnections.  As a result, a reliable and quantitative thermomechanical analysis of the solder at different temperatures is in need. The Nano module of the Nanovea Mechanical Tester applies the load by a high-precision piezo and directly measures the evolution of force and displacement. The advanced heating oven provides a uniform temperature at the tip and sample surface, which ensures measuring accuracy and minimizes the influence of thermal drift.

Thermomechanical Analysis of Solder Using Nanoindentation