3D Topography With Image Overlay of PCB

The more sophisticated electronic design and layout of semiconductor chips, circuits and systems requires high precision manufacturing and superior quality control. Unlike other techniques such as touch probes or interferometry, the Nanovea 3D Non-Contact Profilometer, using axial chromatism, can measure nearly any material surface. Nano through macro range is obtained during surface profile measurement with zero influence from sample reflectivity, absorption and high surface angles. This is ideal for surface inspection of the PCB assembly (PCBA), which contains a variety of electronic components of different materials, reflectivity and fine features. Moreover, the non-contact profiling technique measures the surface features without touching the PCBA, avoiding the risk of damaging the delicate circuits and electronic components due to sliding of the probe stylus. The combination of high precision, high speed, non-contact and user friendliness makes the Nanovea Profilometer an ideal tool for PCBA inspection.

3D Topography With Image Overlay of PCB