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Thermomechanical Analysis of Solder Using Nanoindentation
Solder joints are subjected to thermal and/or external stress when the temperature exceeds 0.6 Tm where Tm is the melting point of the material in Kelvin. The creep behavior of solders at elevated temperatures can directly influence the reliability of solder interconnections. As a result, a reliable and quantitative thermomechanical analysis of the solder at different temperatures is in need. The Nano module of the Nanovea Mechanical Tester applies the load by a high-precision piezo and directly measures the evolution of force and displacement. The advanced heating oven provides a uniform temperature at the tip and sample surface, which ensures measuring accuracy and minimizes the influence of thermal drift.
Thermomechanical Analysis of Solder Using Nanoindentation
Metallurgy Study of Multiphase Material Using Nanoindentation
Metallurgy studies the physical and chemical behavior of metallic elements, as well as their intermetallic compounds and alloys. Metals undergoing working processes, such as casting, forging, rolling, extrusion and machining, etc., change their phases, microstructure and texture, which results in varied physical properties including hardness, strength, toughness, ductility, and wear resistance. Metallography is often applied to learn the formation mechanism of such specific phases, microstructure and texture.
Metallurgy Study of Multiphase Material Using Nanoindentation
