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		<title>Mechanical Properties of Silicon Carbide Wafer Coatings</title>
		<link>https://nanovea.com/mechanical-properties-of-silicon-carbide-wafer-coatings/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=mechanical-properties-of-silicon-carbide-wafer-coatings</link>
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		<dc:creator><![CDATA[nanovea]]></dc:creator>
		<pubDate>Thu, 29 Mar 2018 13:50:56 +0000</pubDate>
				<category><![CDATA[Application Notes]]></category>
		<category><![CDATA[Friction Testing | Coefficient of Friction]]></category>
		<category><![CDATA[Indentation | Hardness and Elastic]]></category>
		<category><![CDATA[Laboratory Testing]]></category>
		<category><![CDATA[Mechanical Testing]]></category>
		<category><![CDATA[Profilometry | Volume and Area]]></category>
		<category><![CDATA[Profilometry Testing]]></category>
		<category><![CDATA[Scratch Testing | Adhesive Failure]]></category>
		<category><![CDATA[Scratch Testing | Cohesive Failure]]></category>
		<category><![CDATA[Properties of Silicon]]></category>
		<guid isPermaLink="false">https://nanovea.com/?p=3355</guid>

					<description><![CDATA[<p>Understanding the mechanical properties of silicon carbide wafer coatings is critical. The fabrication process for microelectronic devices can have over 300 different processing steps and can take anywhere from six to eight weeks. During this process, the wafer substrate must be able to withstand the extreme conditions of manufacturing, since a failure at any step [&#8230;]</p>
<p>The post <a href="https://nanovea.com/mechanical-properties-of-silicon-carbide-wafer-coatings/">Mechanical Properties of Silicon Carbide Wafer Coatings</a> appeared first on <a href="https://nanovea.com">NANOVEA: Advanced Profilometers, Tribometers, Nanoindenters, and Scratch Testers for Materials Testing</a>.</p>
]]></description>
										<content:encoded><![CDATA[<p>Understanding the mechanical properties of silicon carbide wafer coatings is critical. The fabrication process for microelectronic devices can have over 300 different processing steps and can take anywhere from six to eight weeks. During this process, the wafer substrate must be able to withstand the extreme conditions of manufacturing, since a failure at any step would result in the loss of time and money. The testing of <a href="https://nanovea.com/micro-indentation-tester/">hardness</a>, adhesion/scratch resistance and COF/wear rate of the wafer must meet certain requirements in order to survive the conditions imposed during the manufacturing and application process to insure a failure will not occur.</p>
<p><a href="http://nanovea.com/App-Notes/NanoindentationofWafer.pdf">Mechanical Properties of Silicon Carbide Wafer Coatings</a></p>
<p>The post <a href="https://nanovea.com/mechanical-properties-of-silicon-carbide-wafer-coatings/">Mechanical Properties of Silicon Carbide Wafer Coatings</a> appeared first on <a href="https://nanovea.com">NANOVEA: Advanced Profilometers, Tribometers, Nanoindenters, and Scratch Testers for Materials Testing</a>.</p>
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