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	<title>thermomechanical analysis Archives -</title>
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	<description>Strumenti metrologici per la ricerca e il controllo qualità dei materiali</description>
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		<title>Analisi termomeccanica delle saldature mediante nanoindentazione</title>
		<link>https://nanovea.com/it/analisi-termomeccanica-delle-saldature-con-la-nanoindentazione/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=thermomechanical-analysis-of-solder-using-nanoindentation</link>
					<comments>https://nanovea.com/it/analisi-termomeccanica-delle-saldature-con-la-nanoindentazione/#respond</comments>
		
		<dc:creator><![CDATA[nanovea]]></dc:creator>
		<pubDate>Tue, 24 Nov 2015 15:44:44 +0000</pubDate>
				<category><![CDATA[Application Notes]]></category>
		<category><![CDATA[High Temperature Mechanical Testing]]></category>
		<category><![CDATA[Mechanical Properties]]></category>
		<category><![CDATA[nanoindentation]]></category>
		<category><![CDATA[thermomechanical analysis]]></category>
		<guid ispermalink="false">http://nanovea.com/?p=2143</guid>

					<description><![CDATA[<p>Solder joints are subjected to thermal and/or external stress when the temperature exceeds 0.6 Tm where Tm is the melting point of the material in Kelvin. The creep behavior of solders at elevated temperatures can directly influence the reliability of solder interconnections.  As a result, a reliable and quantitative thermomechanical analysis of the solder at [&#8230;]</p>
<p>The post <a href="https://nanovea.com/it/analisi-termomeccanica-delle-saldature-con-la-nanoindentazione/">Thermomechanical Analysis of Solder Using Nanoindentation</a> appeared first on <a href="https://nanovea.com/it">NANOVEA: Advanced Profilometers, Tribometers, Nanoindenters, and Scratch Testers for Materials Testing</a>.</p>
]]></description>
										<content:encoded><![CDATA[<p>Le giunzioni a saldare sono soggette a sollecitazioni termiche e/o esterne quando la temperatura supera lo 0,6 <em>T</em><sub>m</sub> dove <em>T</em><sub>m</sub> è il punto di fusione del materiale in Kelvin. Il comportamento di creep delle saldature a temperature elevate può influenzare direttamente l'affidabilità delle interconnessioni a saldare.<a href="#_edn1" name="_ednref1">. </a> Di conseguenza, è necessaria un’analisi termomeccanica affidabile e quantitativa della saldatura a diverse temperature. IL <a href="https://nanovea.com/nano-indentation-tester/">Nanomodulo</a> della Nanovea <a href="https://nanovea.com/mechanical-testers/">Collaudatore meccanico</a> applica il carico tramite un piezoelettrico ad alta precisione e misura direttamente l&#039;evoluzione della forza e dello spostamento. Il forno di riscaldamento avanzato fornisce una temperatura uniforme sulla punta e sulla superficie del campione, garantendo la precisione della misurazione e minimizzando l&#039;influenza della deriva termica.</p>
<p><a href="https://nanovea.com/wp-content/themes/wp-nanovea/Application%20Notes/thermomechanical-analysis.pdf" target="_blank" rel="noopener noreferrer">Analisi termomeccanica delle saldature mediante nanoindentazione</a></p>
<p>&nbsp;</p><p>The post <a href="https://nanovea.com/it/analisi-termomeccanica-delle-saldature-con-la-nanoindentazione/">Thermomechanical Analysis of Solder Using Nanoindentation</a> appeared first on <a href="https://nanovea.com/it">NANOVEA: Advanced Profilometers, Tribometers, Nanoindenters, and Scratch Testers for Materials Testing</a>.</p>
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